English

Zeshancheng-1206 is a thermoplastic polyimide micro powder with low dielectric constant and dielectric loss at high frequency, high temperature resistance, low density, good compatibility in mixing, and low water absorption rate.

characteristic ：

At room temperature, Zeshancheng-1206 micro powder dissolves completely in N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAC), N-methylpyrrolidone (NMP), m-cresol, dimethyl sulfoxide (DMSO), γ-butyrolactone (GBL), benzyl ether (Anisole), 1,4-dioxane, carbon tetrachloride, dichloromethane, and trichloromethane, with a solid content of up to 40%. It is insoluble in ethylene glycol dimethyl ether, butanone, and toluene.

Zeshancheng-1206 micro-powder was tested by DSC, showing a glass transition temperature of approximately 300℃. TGA analysis indicated a 2.0% thermal decomposition temperature of about 524℃.

At 20GHz, the dielectric constant is 2.8~3.0 and the dielectric loss is 0.001~0.004.

When Zeshancheng-1206 micro-powder is incorporated into thermosetting matrix resins or diluents, its particles undergo interfacial dissolution and swelling (interfacial mutual diffusion) at 60-140°C. This facilitates uniform dispersion of particles within the resin matrix. Upon curing, the resin forms a robust 'anchor effect' interface with the particles, enhancing stress transfer and absorption capabilities. Consequently, the toughening effect is particularly pronounced.

Material application:

A, used to make components used under high temperature and high frequency conditions

B, for high-frequency signal lines or conductors with high-temperature resistant insulation coating

C, for toughening modification of thermosetting matrix resin

D, serving as a low dielectric strength & high toughness thermoplastic matrix resin